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At present, the solvent-free laminating machines used at home and abroad are mostly two-layer lamination, single-station winding and unwinding structure. Its main structure includes: a unwinding unit, a coating unit, a second unwinding unit, a compound unit, and a winding unit.
Special: It can only be used for solvent-free laminating machines, with two-layer structure and three-layer structure forming at one time; it is divided into manual roll change and automatic roll change.
Combination: It can be used for solvent-free compounding, and the coating unit can also be switched, and the oven can be activated at the same time to achieve dry compounding. Two of these models can be connected in series, so that the three-layer structure can be formed at one time. For example: PET/AL/PE, one machine uses dry compounding to produce PET/AL, and two machines in series can further complete the compounding of PET/AL and PE in a solvent-free way.
Multi-function: Solvent-free, dry compound (solvent glue and water glue), PVDC coating, cold seal glue positioning coating, hot melt glue coating, reverse printing, etc. can be realized by switching the coating unit.
Solvent-free compound machine
Working principle of solvent-free compound machine
The models are divided into:
>Solvent-free special type,
>Solvent-free and dry compound type,
>Multifunctional combination type.
The above information is provided to you by the solvent-free compound machine manufacturer, hoping to help you.
Use skills of compound machine
1. Increase the amount of glue applied. If the amount of glue applied is too small or the surface of some substrates is not coated with adhesive, it will cause the two substrates to be difficult to fit together during compounding. We can choose an anilox roller with deeper cells, or increase the amount of glue on the surface of the substrate by increasing the pressure of the rubber roller and reducing the contact pressure between the doctor blade and the anilox roller. For some plastic film substrates, corona treatment can be performed before coating to make the surface fluffy, thereby improving the substrate's ability to absorb adhesives and increasing the amount of glue on the surface.
2. If the appropriate drying temperature is too high or too low, the bonding fastness of the composite film will be affected. When the coating substrate is dried, the heating temperature is too high or the high temperature cooking will cause the surface layer of the adhesive to be carbonized, thereby destroying the bonding ability of the adhesive. If the drying temperature is too low, the adhesive will not be cured, the viscosity of the adhesive will be poor, and the compounding will not be strong. After a period of time, air bubbles are easily formed in the compounded film, which will destroy the compounding quality of the product. Of course, we can choose an adhesive digital printing machine with good high temperature resistance and cooking resistance to adapt to higher temperature drying.